GMA05XB30J104M
Small, high capacity for wire and die bonding
multilayer microchip capacitor

■Size

• 0.5×0.5×0.35mm

■Application

• Optical modules

■Features

• TC Code (JIS Code): B
• Rated voltage: 6.3V
• Capacitance: 0.1µF
• Outer electrode is Au.
• Wire bonding: Vertical break resistance over 3.0g
• Die bonding: Die share strength over 200g

October 2006 CEATEC